this is information on a product in full production. october 2014 docid027019 rev1 1/8 8 STPS2170 power schottky rectifier datasheet ? production data features ? negligible switching losses ? high junction temperature capability ? very small conduction losses ? low leakage current ? avalanche rated ? ecopack ? compliant component ? t j = -40 c minimum operating description the STPS2170 is a 170 v schottky rectifier suited for switch mode power supplies and high frequency dc to dc converters. packaged in smaflat, this device is especially intended for use in low voltage, high frequency inverters, freewheeling and polarity protection. also ideal for all led lighting applications where efficiency and space constraint are required. 6 0 $ i o d w . $ . $ table 1. device summary symbol value i f(av) 2 a v rrm 170 v v f (typ) 0.62 v t j (max) 175 c www.st.com
characteristics STPS2170 2/8 docid027019 rev1 1 characteristics to evaluate the conduction losses use the following equation: p = 0.59 x i f(av) + 0.04 x i f 2 (rms) table 2. absolute ratings (limiting values at 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 170 v v rrm repetitive peak reverse voltage, t j = -40 c 160 v i f(rms) forward rms current 15 a i f(av) average forward current, = 0.5, square wave smaflat, t l = 145 c 2a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 70 a p arm (1) repetitive peak avalanche power, square wave t p = 10 s, t j = 125 c 165 w t stg storage temperature range -65 to +175 c t j operating junction temperature (2) -40 to +175 c 1. for pulse time duration deratings, please refer to figure 3 . more details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the stmicroelectronics application notes an1768, ?admissible avalanche power of schottky diodes? and an2025, ?converter improvement using schottky rectifier avalanche specification?. 2. condition to avoid thermal runaway for a diode on its own heatsink dptot dtj --------------- 1 rth j a ? () ------------------------- - < table 3. thermal parameters symbol parameter value unit r th(j-l) junction to lead, smaflat 20 c/w table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 2.8 a t j = 125 c 0.5 2.8 ma v f (2) forward voltage drop t j = 25 c i f = 2 a 0.82 v t j = 125 c 0.62 0.67 t j = 25 c i f = 4 a 0.89 t j = 125 c 0.70 0.75 1. pulse test: t p = 5 ms, < 2% 2. pulse test: t p = 380 s, < 2%
docid027019 rev1 3/8 STPS2170 characteristics figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) / / / / / 3 ) $ 9 : , ) $ 9 $ 7 / w s 7 w s 7 d p e ? & , ) $ 9 $ 7 / w s 7 w s 6 0 $ i o d w 5 w k m d 5 w k m o figure 3. normalized avalanche power derating versus pulse duration (pulse > 10 s, t j <150c) figure 4. relative variation of thermal impedance junction to lead versus pulse duration w 3 ? v 3 $ 5 0 w 3 3 $ 5 0 ? v ( ( ( ( ( ( = w k m o 5 w k m o w 3 v 6 l q j o h s x o v h figure 5. reverse leakage current versus reverse voltage applied (typical values) figure 6. junction capacitance versus reverse voltage applied (typical values) , 5 ? $ ( ( ( ( ( ( ( 9 5 9 7 m ? & 7 m ? & 7 m ? & 7 m ? & 7 m ? & 7 m ? & & s ) 9 5 9 ) 0 + ] 9 2 6 & p 9 5 0 6 7 m ? &
characteristics STPS2170 4/8 docid027019 rev1 figure 9. thermal resistance junction to ambient versus copper surface under each lead (typical values) figure 7. forward voltage drop versus forward current (typical values) figure 8. forward voltage drop versus forward current (maximum values) , ) $ 7 m ? & 9 ) 9 7 m ? & , ) $ 7 m ? & 9 ) 9 7 m ? & 5 w k m d ? & : 6 & 8 f p e 6 0 $ i o d w ( s r [ \ s u l q w h g e r d u g ) 5 h & 8 ? p
docid027019 rev1 5/8 STPS2170 package information 2 package information ? epoxy meets ul94,v0 ? lead-free package ? band indicates cathode in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. smaflat dimensions definitions ' $ / [ / / [ / [ ( ( e f
package information STPS2170 6/8 docid027019 rev1 figure 11. smaflat footprint, dimensions in mm (inches) figure 12. marking informations table 5. smaflat dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.10 0.035 0.043 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.95 0.088 0.116 e 4.80 5.60 0.189 0.220 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 l1 0.50 0.019 l2 0.50 0.019 \ z z h ] [ [ [ h ( & 2 3 $ & . / h d g i u h h ; ; ; 0 d u n l q j = 0 d q x i d f w x u l q j o r f d w l r q < < h d u : : z h h n & d w k r g h e d u x q l g l u h f w l r q d o g h y l f h v r q o \
docid027019 rev1 7/8 STPS2170 ordering information 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode STPS2170af f2170 smaflat 0.035 g 10000 tape and reel table 7. document revision history date revision changes 14-oct-2014 1 first release.
STPS2170 8/8 docid027019 rev1 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved
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